Hexagonal boron nitride (h-BN) is an inorganic crystalline compound composed of boron and nitrogen atoms. It has a layered structure similar to that of graphite, with alternating single layers of boron and nitrogen bonded together in a Hexagonal Boron Nitride lattice.
Hexagonal Boron Nitride unique material properties originate from its stable structure dominated by sp2 hybridized in-plane bonds and van der Waals interactions between the layers.
Properties of Hexagonal Boron Nitride Industry
Some key properties of h-BN include:
– Thermal Stability: h-BN has an extremely high melting point of 3000°C in vacuum due to its strong covalent bonding within the layers. It retains its structure and properties up to such high temperatures, making it attractive for applications requiring thermal management and insulation.
– Electrical Insulation: h-BN is a wide-bandgap semiconductor with an optical bandgap of 5.955 eV. It has low electrical and thermal conductivity, acting as an excellent electrical insulator.
– Chemical Inertness: The sp2-hybridized bonds make h-BN chemically and thermally very stable. It is inert to both acids and bases and withstands oxidizing/reducing environments.
– High Thermal Conductivity: Despite being an electrical insulator, h-BN has a relatively high thermal conductivity of between 180–400 W/mK. It conducts heat efficiently through phonon transport between the layers.
– Layered Structure: h-BN has a layered structure similar to graphite with weak interlayer van der Waals interactions. The layers can be exfoliated or delaminated for use in 2D materials applications.
– Optical Transparency: h-BN is highly transparent to visible light and the infrared/ultraviolet ranges due to its wide bandgap, making it promising for optoelectronic applications.
Global Hexagonal Boron Nitride Market Drivers
Semiconductor Industry Applications:
– Dielectric material in semiconductor manufacturing: h-BN’s superior electrical insulation and thermal conductivity make it an ideal gate oxide material, replacing conventional amorphous dielectrics like silicon dioxide. It allows for thinner barriers without leakage in advanced transistor fabrication. The global semiconductor market boom drives demand for improved dielectric materials.
Thermal Management Applications:
– Substrate and filler in thermal interface materials (TIMs): h-BN conducts heat efficiently and its weak van der Waals bonding allows for self-assembly and filler loading. It is seeing increasing use as a substrate and filler in high-performance greases, adhesives, and pastes used between components and heat sinks. Demand is driven by growing consumer electronics and GPU/CPU industries.
– Refractory material: h-BN’s extreme heat resistance makes it valuable as a facing brick material for linings in very high temperature industrial furnaces and equipment, like those used in metals processing. Growth in manufacturing industries drives refractories demand.
Other Growth Drivers:
– Lubrication: h-BN is used as a dry lubricant powder additive or filler due to its low friction and high temperature stability properties. Demand comes from automotive and industrial sectors.
– 2D Materials and Graphene: h-BN is indispensable as an insulating substrate and protective layer material for graphene and other 2D materials used in next-gen devices. This application area is poised for exponential growth.
– Optoelectronics: Emerging interest in h-BN’s wide bandgap, high thermal/electrical insulation, and optical transparency properties for novel optoelectronic applications like deep UV LEDs.
The combination of h-BN’s versatility, increasing industrial usage, and expanding application frontiers in strategic technologies ensures robust long-term global market increases.
Global Hexagonal Boron Nitride Regional Markets
Asia Pacific currently dominates the global h-BN market due to its position as the world’s largest manufacturing hub for electronics and semiconductors. China is the worldwide production and consumption leader. Other major APAC markets include Taiwan, South Korea and Japan.
North America is the second largest overall region. The massive US semiconductor industry drives major dielectric consumption for chip manufacturing. Other notable end uses include thermal management greases/adhesives and refractories.
Europe has a sizeable h-BN market anchored by large consumer electronics, automotive and manufacturing industries. Key country markets are Germany, France, UK and Italy.
The Middle East and Africa region is smaller currently but has potential for future growth linked to expansion of metal fabrication and oil & gas sectors across the Gulf Cooperation Council countries and North Africa specifically.
South America’s h-BN market is much smaller in scale today but countries like Brazil have developing industrial/tech manufacturing bases that can contribute to regional requirements going forward.
Global Hexagonal Boron Nitride Industry Players
On the supply side, leading h-BN producers include Saint-Gobain, Momentive Performance Materials, 3M, Denka, Henze, Showa Denko and Shin-Etsu Chemical.
In Summary, downstream, major applications sectors include semiconductor firms like Intel, Samsung and TSMC as major dielectric buyers. Thermal management material producers such as Henkel, Laird Thermal Systems and Bergquist source h-BN for products. Graphene/2D materials companies including Graphene NanoChem, XG Sciences and Haydale Graphene Industries utilize h-BN extensively. Automotive, industrial equipment and electronics brands also source h-BN indirectly for diverse end use applications.
*Note:
1. Source: Coherent Market Insights, Public sources, Desk research
2. We have leveraged AI tools to mine information and compile it
Author Bio:
Money Singh is a seasoned content writer with over four years of experience in the market research sector. Her expertise spans various industries, including food and beverages, biotechnology, chemical and materials, defense and aerospace, consumer goods, etc. (https://www.linkedin.com/in/money-singh-590844163)
